By Qingke Zhang
presents a sequence of mechanical try out tools and comprehensively investigates
the deformation and harm habit of Cu/Pb-free solder joints below different
loading stipulations. The fracture habit of Pb-free joint interfaces induced
by tension, deformation of solder and substrate are proven, the shear fracture
strength of the Cu6Sn5 IMC is measured experimentally for the 1st time, and
the dynamic harm procedure and microstructure evolution habit of Pb-free
solder joints are printed intuitively. The thesis places ahead the argument
that the neighborhood cumulative harm is the foremost explanation for failure in solder
joints. The examine effects give you the experimental and theoretical foundation for
improving the reliability of solder joints.
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